Process Engineer: System in Package

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

We are seeking a highly motivated System-in-Package (SiP) R&D Engineer to lead the development of next-generation SiP modules integrated with microwave and mmWave subsystems across Keysight, serving multiple industries. This role focuses on process development, process integration, and New Product Introduction (NPI), driving innovation that differentiates Keysight in emerging markets such as 6G and AI.

• Develop and maintain package assembly processes.
• Specify, select, and qualify new equipment for advanced packaging.
• Contribute to process automation and Industry 4.0 initiatives to improve efficiency.
• Review new designs for manufacturability and provide feedback to IC and module designers.
• Absorb and understand process flows, product design, and performance requirements; lead manufacturing teams to develop new products that meet performance targets.
• Drive technical development of new SiP introductions in collaboration with upstream design teams, process/manufacturing teams, and downstream customer teams.
• Manage accelerated project schedules, communicate risks, while ensuring timely delivery.
• Maintain high yields while adhering to project timelines.

Proven experience in some or all of the following areas:

• Design for manufacturing of electromechanical assemblies.
• Statistical process control (SPC), design of experiments (DOE), Process Failure Mode and Effects Analysis (PFMEA), Lean Manufacturing.
• High Accuracy/High Rate Thermocompression or flip-chip bonding.
• Surface Mount Technology (SMT) processes.
• Die singulation and semiconductor fabrication processes.
• Heterogeneous integration and advanced packaging techniques.
• New technology and product introduction.

• Bachelor's or Master's or Phd degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• Strong leadership, drive, and ambition to realize novel technologies.
• Excellent interpersonal and communication skills for cross-functional collaboration.

BS or MS or PhD in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields.

Professional experience in the following areas is desired:

• III-V compound semiconductors and/or silicon technologies
• Thermal, mechanical and electrical reliability
• Technical project management, project lifecycle

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